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Design of Low Pass Filter using Integrated Fractal Passive Components for GSM Application

P. Akhendra Kumar, N. Bheema Rao. Published in Circuits and Systems.

Communications on Applied Electronics
Year of Publication: 2017
Publisher: Foundation of Computer Science (FCS), NY, USA
Authors: P. Akhendra Kumar, N. Bheema Rao
10.5120/cae2017652725

Akhendra P Kumar and Bheema N Rao. Design of Low Pass Filter using Integrated Fractal Passive Components for GSM Application. Communications on Applied Electronics 7(10):1-3, December 2017. BibTeX

@article{10.5120/cae2017652725,
	author = {P. Akhendra Kumar and N. Bheema Rao},
	title = {Design of Low Pass Filter using Integrated Fractal Passive Components for GSM Application},
	journal = {Communications on Applied Electronics},
	issue_date = {December 2017},
	volume = {7},
	number = {10},
	month = {Dec},
	year = {2017},
	issn = {2394-4714},
	pages = {1-3},
	numpages = {3},
	url = {http://www.caeaccess.org/archives/volume7/number10/782-2017652725},
	doi = {10.5120/cae2017652725},
	publisher = {Foundation of Computer Science (FCS), NY, USA},
	address = {New York, USA}
}

Abstract

In this paper, Elliptical Low pass filter working at GSM band is realized using multilayer fractal spiral inductor and fractal spiral capacitor based 0.18 μm process. Multilayer fractal inductor and fractal spiral capacitor is shown to have good Q factor values. The influence of fractal passive components on the insertion loss of low pass filter is analyzed by EM simulations. The designed 3.17nH multilayer inductor has a maximum Q of 30 @ 6 GHz and the realized LPF GSM/AMPS band has the insertion loss of 0.4dB and return loss of more than 15dB in the passband.

References

  1. D. Pedder, “Technology and infrastructure for embedded passive components,” On Board Technology, pp. 8–111, 2005.
  2. R. K. Ulrich, W. D. Brown, S. S. Ang, F. D. Barlow, A. Elshabini, T. G. Lenihan, H. A. Naseem, D. M. Nelms, J. Parkerson, L. W. Schaper, and G. Morcan, “Getting aggressive with passive devices,” IEEE Circuits and Devices Magazine, vol. 16, no. 5, pp. 16–25, Sep 2000.
  3. A. Kar-Roy, C. Hu, M. Racanelli, C. A. Compton, P. Kempf, G. Jolly, P. N. Sherman, J. Zheng, Z. Zhang, and A. Yin, “High density metal insulator metal capacitors using pecvd nitride for mixed signal and rf circuits,” in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), 1999, pp. 245–247.
  4. F. P. Casares-Miranda, P. Otero, E. Marquez-Segura, and C. Camacho-Penalosa, “Wire bonded interdigital capacitor,” IEEE Microwave and Wireless Components Letters, vol. 15, no. 10, pp. 700–702, Oct 2005.
  5. P. A. Kumar and N. B. Rao, “Fractal spiral capacitor for wireless applications,” Electronics Letters, vol. 52, no. 6, pp. 481–483, 2016.
  6. P.A.Kumar and N. B. Rao, “Fractal spiral capacitor for rf applications,” in 2016 IEEE First International Conference on Control, Measurement and Instrumentation (CMI), Jan 2016, pp. 58–61.
  7. G. Wang, L. Xu, and T. Wang, “A novel mems fractal inductor based on hilbert curve,” in 2012 Fourth International Conference on Computational Intelligence and Communication Networks, Nov 2012, pp. 241–244.
  8. N. Lazarus, C. D. Meyer, and S. S. Bedair, “Fractal inductors,” IEEE Transactions on Magnetics, vol. 50, no. 4, pp. 1–8, April 2014.
  9. P. A. Kumar and N. B. Rao, “Design of multi-layer fractal inductor for rf applications,” in 2015 International Conference on Microwave, Optical and Communication Engineering (ICMOCE), Dec 2015, pp. 295–298.
  10. L. Liu, S. M. Kuo, J. Abrokwah, M. Ray, D. Maurer, and M. Miller, “Compact harmonic filter design and fabrication using ipd technology,” IEEE Transactions on Components and Packaging Technologies, vol. 30, no. 4, pp. 556–562, Dec 2007.
  11. K. Zoschke, J. Wolf, M. Topper, O. Ehrmann, T. Fritzsch, K. Scherpinski, H. Reichl, and F. J. Schmuckle, “Thin film integration of passives - single components, filters, integrated passive devices,” in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), vol. 1, June 2004, pp. 294–301 Vol.1.

Keywords

Fractal spiral capacitor, High Frequency Structural Simulator( HFSS), Low pass Filter(LPF), Inductance value(L), Multilayered fractal inductor, Quality factor(Q), Self Resonant Frequency( SRF)